6 layers of just wound plate
Number of layers: 6L (2R + 2F + 2R)
Plate thickness: 0.8±0.1mm
Minimum line width / line spacing: 0.076mm / 0.1mm
Surface treatment: nickel-plated gold
Size: 118mm*45mm
Application area: consumer electronics
Number of layers: 6L (2R + 2F + 2R)
Plate thickness: 0.8±0.1mm
Minimum line width / line spacing: 0.076mm / 0.1mm
Surface treatment: nickel-plated gold
Size: 118mm*45mm
Application area: consumer electronics
Number of layers: 6L (2R + 2F + 2R)
Plate thickness: 0.8±0.1mm
Minimum line width / line spacing: 0.076mm / 0.1mm
Surface treatment: nickel-plated gold
Size: 118mm*45mm
Application area: consumer electronics
Number of layers: 8L (1R+2F+1R)
Plate thickness: 1.2±0.1mm
Minimum line width / line spacing: 0.2mm / 0.14mm
Surface treatment: nickel-plated gold
Size: 57mm*18mm
Application area: industrial control
Number of layers: 10L (4R+10F+4R)
Plate thickness: 2.0 ± 0.2mm
Minimum line width: 0.2mm/0.2mm
Minimum via hole / PAD: 0.4mm / 1.0mm
Minimum distance from hole to line: 0.3mm
Surface treatment: nickel-plated gold
Application area: control board
Surface treatment: immersion gold
Number of floors: 4
Finished plate thickness: 0.22mm
Minimum finished hole diameter: 0.2mm
Minimum line width / line spacing: 0.055/0.057mm
Particularity: Impedance accuracy: ±10% Ω
Application: Drone
Surface treatment: immersion gold
Number of floors: 4
Finished plate thickness: 0.22mm
Minimum finished hole diameter: 0.2mm
Minimum line width / line spacing: 0.055/0.057mm
Particularity: Impedance accuracy: ±10% Ω
Application: Drone
Ultrasound probe soft board
Name: Ultrasound probe soft board
Number of layers: 2L
Material: PI
Plate thickness: 0.09mm
Copper thickness: 6um ± 1um
Minimum aperture: 50um
Size: 84mm*168mm
Surface treatment: electroplated soft gold
Application area: medical
Features: ultra-thin copper, micro-hole, appearance zero defect FPC
Surface treatment: immersion gold
Number of floors: 4
Finished plate thickness: 0.4+/-0.05mm
Minimum finished hole diameter: 0.15mm
Minimum line width / line spacing: 0.07/0.06mm
Particularity:
Application: Industrial Robot
Surface treatment: electroplated gold
Number of floors: 2
Finished plate thickness: 0.12±0.03mm
Minimum finished hole diameter: 0.15mm
Minimum line width / line spacing: 0.05/0.05mm
Particularity: Impedance accuracy ±10%
Application: Car display
Product Category: Communication Backplane PCB
Number of floors: 28 layers
Plate thickness: 5.46+/-0.533mm
Size: 165.1mm*87.63mm
Plate used: FR4
Surface treatment: immersion gold
Application area: Communication
Features: high multilayer backplane
Product Category: Communication Backplane PCB
Number of floors: 28 layers
Plate thickness: 5.46+/-0.533mm
Size: 165.1mm*87.63mm
Plate used: FR4
Surface treatment: immersion gold
Application area: Communication
Features: high multilayer backplane
Product Category: Security PCB
Number of floors: 8 layers
Plate thickness: 1 +/- 0.1mm
Size: 248.02mm * 112mm
Plate used: Taiwan Light (EM-825)
Minimum aperture: 0.2mm
Surface treatment: immersion gold
Minimum line width / distance: 0.104mm / 0.098mm
Terminal products: security IPC board
Product Category: Communication blind buried plate
Number of floors: 4 layers
Plate thickness: 1.0mm
Size: 137.16mm*89.92mm
Plate used: FR4
Minimum aperture: 0.25mm
Surface treatment: immersion gold
Application area: Communication
Features: blind buried hole design
Product Category: Power Thick Copper PCB
Number of floors: 10 layers
Plate thickness: 2.6mm
Size: 180mm*220.5mm
Plate used: FR4
Minimum aperture: 0.35mm
Surface treatment: immersion gold
Application area: power supply
Features: Copper thickness 4OZ
Product Category: Graphics Card PCB
Number of floors: 12 layers
Plate thickness: 1.6mm
Size: 290mm*136mm
Plate used: FR4
Minimum aperture: 0.25mm
Surface treatment: OSP+ gold plating
Application area: computer graphics
Features: gold-plated fingers
Product Category: Blind buried plate
Number of layers: 10 (1+1+6+1+1)
Plate thickness: 1.0mm
Size: 205.015*62.53mm
Plate used: FR4
Minimum aperture: 0.10mm
Surface treatment: OSP
Application area: consumer
Features: Electroplating blind hole process
Product Category: Blind buried plate
Number of layers: 10 (1+1+6+1+1)
Plate thickness: 1.0mm
Size: 205.015*62.53mm
Plate used: FR4
Minimum aperture: 0.10mm
Surface treatment: OSP
Application area: consumer
Features: Electroplating blind hole process
Number of floors: 14
Plate thickness: 1.6±0.16mm
Size: 150mm*160mm
Minimum line width / spacing: 0.08/0.1mm
Impedance control
Application area: Communication
Number of floors: 14
Plate thickness: 1.6±0.16mm
Size: 150mm*160mm
Minimum line width / spacing: 0.08/0.1mm
Impedance control
Application area: Communication
Number of floors: 6
Plate thickness: 1.6mm ± 0.16
Process: Rogers + FR-4 mixed pressure,
Application area: automotive radar
Buried server PCB
Number of floors: 24
Plate thickness: 2.1 ± 0.21mm
Minimum aperture: 0.3mm
Line width line spacing: 0.127mm / 0.127mm
Surface treatment: nickel-plated gold
Process: 24 layers buried
Application area: server
Number of floors: 2
Plate thickness: 0.5±0.05mm
Size: 5mm*2mm
Application area: industrial induction
Number of layers: 10
Plate thickness: 2.0mm
Copper thickness: 1OZ
Material: RO4350+FR4
Uses: microwave
Process point: step waveguide slot
Number of floors: 12
Plate thickness:2.6mm
Copper thickness oz:1
Material:Rogers4350B+FR4
Type: metal base power amplifier board
Technical features: "Integrated design
Local mixed pressure
PCB buried I / U copper
Control deep power amplifier slot"
Uses: wireless communication base station